Insulated ferromagnetic laminates and method of manufacturing

ABSTRACT

A method of making a component of an electric machine using an additive manufacturing process is disclosed. The method includes forming a first lamina of a conductive material, building a first layer of a second material on a first surface of the first lamina, treating the second material on the first surface of the first lamina to define a first insulative layer, and building on the first insulative layer a second lamina of a conductive material. The steps can be repeated iteratively until a desired thickness or number of layers is reached.

TECHNICAL FIELD

This invention relates to generally to an additive manufacturing processto manufacture laminated ferromagnetic components for electric machines.

BACKGROUND

In electric machines, such as motors and generators, ferromagnetic partschannel magnetic flux. These parts are conventionally structured asinsulated plates or laminas (typically of iron or iron alloy) assembledor stacked together to form a core of the ferromagnetic part. The coremay define a rotor or a stator. An insulation layer is disposed betweeneach lamina to insulate the respective lamina (e.g., as a barrier toeddy currents) from adjacent laminas in the core. Typically, thethickness of one repeating lamination unit is composed of 95% (so calledstacking factor) magnetic sheet and 5% insulation. For example, atypical lamination sheet thickness may be about 0.010 inch (i.e., 10mils), and the insulating layer may be 0.5 mil or less

Electric machine magnetic laminated cores often comprise a circularstructure (e.g., a donut-shaped ring) which may include features such asslots arranged to receive windings therein. In other examples, thelaminated core may comprise a rectangular structure (e.g., an E-shapedframe). However, laminated cores can comprise any number of desiredshapes, sizes, and geometries. Each repeating laminated structure istypically composed of one layer of magnetic sheet and one layer ofinsulating sheet, and the magnetic core could have any number of suchrepeating laminated structure.

With conventional methodologies, assembling multiple insulated laminatedparts together to form a single part or core presents many challenges.More complex topologies may decrease losses, increase magnetic fluxdensity, or both, but are difficult to manufacture.

More recently, additive manufacturing (AM) technologies have been usedto optimize part and system design and reduce defects compared totraditional casting. However, conventional AM technology has beenlimited in its ability to produce magnetic laminations because of thechallenges presented in building the insulating layer between themagnetic sheets. For example, at least one conventional approach tomanufacturing ferromagnetic laminations has been to apply a polymericdielectric material as an electrical insulator between the laminationsheets. The use of such polymeric materials limits the machine operatingtemperature to be no greater than 300° C.

BRIEF DESCRIPTION

In one aspect, the present disclosure relates to a method of making alaminated ferromagnetic component of an electric machine. The methodincludes forming a first lamina of a first conductive material, forminga layer of a second material on a first surface of the first lamina, andtreating the layer of the second material to thereby define a firstinsulative layer. The method further includes forming, on the firstinsulative layer, a second lamina of the first conductive material.

In another aspect, the present disclosure relates to an additivemanufacturing system configured to form a first lamina of a conductivefirst material, deposit a layer of a second material on a first surfaceof the first lamina and treat the layer of the second material tothereby define a first insulative layer. The system is also configuredto form, on the first insulative layer, a second lamina of a conductivethird material.

These and other features, aspects and advantages of the presentdisclosure will become better understood with reference to the followingdescription and appended claims. The accompanying drawings, which areincorporated in and constitute a part of this specification, illustrateaspects of the disclosure and, together with the description, serve toexplain the principles of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

A full and enabling disclosure of the present description, including thebest mode thereof, directed to one of ordinary skill in the art, is setforth in the specification, which makes reference to the appended FIGS.,in which:

FIG. 1 illustrates a diagrammatic view of an additive manufacturingsystem in accordance with various aspects described herein;

FIG. 2 illustrates a diagrammatic view of the additive manufacturingsystem of FIG. 1 with a second layer, in accordance with various aspectsdescribed herein;

FIG. 3 illustrates a diagrammatic view of an additive manufacturingsystem, with a first insulative layer, in accordance with variousaspects described herein;

FIG. 4 illustrates a diagrammatic view of the additive manufacturingsystem of FIG. 3 with a sinter treatment in accordance with variousaspects described herein;

FIG. 5 illustrates a diagrammatic view of an additive manufacturingsystem, with a chemical treatment of the first insulative layer inaccordance with various aspects described herein;

FIG. 6 illustrates a diagrammatic view of an alternative additivemanufacturing system in accordance with various aspects describedherein;

FIG. 7 illustrates a diagrammatic view of the additive manufacturingsystem of FIG. 6 with a second layer in accordance with various aspectsdescribed herein;

FIGS. 8A-8E illustrate in a sequential diagrammatic view, a laminatedferromagnetic component in accordance with various aspects describedherein;

FIG. 9 is a flow diagram of a method of making a laminated component inaccordance with various aspects described herein; and

FIG. 10 is a flow diagram of an alternative method of making a laminatedcomponent in accordance with various aspects described herein.

DETAILED DESCRIPTION

All directional references (e.g., radial, axial, upper, lower, upward,downward, left, right, lateral, front, back, top, bottom, above, below,vertical, horizontal) are only used for identification purposes to aidthe reader's understanding of the disclosure, and do not createlimitations, particularly as to the position, orientation, or usethereof. Connection references (e.g., attached, coupled, connected, andjoined) are to be construed broadly and can include intermediate membersbetween a collection of elements and relative movement between elementsunless otherwise indicated. As such, connection references do notnecessarily infer that two elements are directly connected and in fixedrelation to each other. The exemplary drawings are for purposes ofillustration only and the dimensions, positions, order and relativesizes reflected in the drawings attached hereto can vary.

It will be understood that the illustrated aspects of the disclosure asdepicted in the Figures herein are only for purposes of illustration andintended as non-limiting examples, and many other possible aspects andconfigurations in addition to that shown are contemplated by the presentdisclosure. It will be understood that while aspects of the disclosureare shown, for ease of understanding, in the simple arrangements shownin the Figures herein, the disclosure is not so limited and has generalapplication to electrical components having any number of laminations.

In accordance with example aspects of the present disclosure, variouscomponents may be formed or “printed” using an additive-manufacturingprocess, such as a three-dimensional printing process. The use of such aprocess may allow the components to be formed integrally, as a singlemonolithic component, or as any suitable number of sub-components. Inparticular, the manufacturing process may allow these components to beintegrally formed and include a variety of features not possible whenusing prior manufacturing methods.

As used herein, the terms “additively manufactured” or “additivemanufacturing techniques or processes” refer generally to manufacturingprocesses wherein successive layers of material(s) are provided on eachother to “build-up”, layer-by-layer, a three-dimensional component. Insome embodiments, the successive layers generally fuse together to forma monolithic component which may have a variety of integralsub-components. Although additive manufacturing technology is describedherein as providing for the fabrication of complex objects by buildingobjects point-by-point, layer-by-layer, typically in a verticaldirection, other methods of fabrication are possible and within thescope of the present disclosure. For example, although the discussionherein refers to the addition of material to form successive layers, oneskilled in the art will appreciate that the methods and structuresdisclosed herein may be practiced with any additive manufacturingtechnique or manufacturing technology. For example, embodiments of thepresent invention may use layer-additive processes, layer-subtractiveprocesses, or hybrid processes.

As used herein, the terms “sinter” or “sintering” refers generally aconventional process of compacting and forming a solid mass of materialby heat or pressure without melting it to the point of liquefaction.

At least some additive manufacturing systems involve the materialbuildup of a component to define any number of three-dimensional (3D)shapes, including a sheet or plate having any desired shape andcross-sectional geometry. Additive manufacturing processes fabricatecomponents using 3D information, for example a 3D computer model, of thecomponent. Accordingly, a 3D design model of the component may bedefined prior to manufacturing. In this regard, a model or prototype ofthe component may be scanned to determine the 3D information of thecomponent. As another example, a model of the component may beconstructed using a suitable computer aided design (CAD) program todefine the 3D design model of the component.

The design model may include 3D numeric coordinates of the entireconfiguration of the component including both external and internalsurfaces of the component. For example, the design model may define thebody, the component base, the surface, any surface features such asirregularities or datum features, as well as internal passageways,openings, support structures, etc. For example, in an aspect, thethree-dimensional design model is converted into a plurality of slicesor segments, e.g., along a central (e.g., vertical) axis of thecomponent or any other suitable axis. Each slice may define atwo-dimensional (2D) cross section of the component for a predeterminedheight of the slice. The plurality of successive 2D cross-sectionalslices together form the 3D component. The component is then “built-up”slice-by-slice, or layer-by-layer, until finished.

In addition, utilizing an additive process, the surface finish andfeatures of the components may vary as needed depending on theapplication. For example, the surface finish can be adjusted (e.g., madesmoother or rougher) by selecting appropriate parameters (e.g., laserparameters) during the additive process. A rougher finish may beachieved by increasing laser scan speed or a thickness of a powderlayer, and a smoother finish can be achieved by decreasing laser scanspeed or the thickness of the powder layer. The laser scanning patternand/or laser power can also be changed to change the surface finish in aselected area of the components.

Various aspects of the disclosure described herein can employ any of anumber of conventional 3D printing, or additive manufacturing (AM)techniques, such as selective laser melting (SLM) or selective lasersintering (SLS). For example, some known additive manufacturing systems,such as Direct Metal Laser Melting (DMLM) systems, can be used tofabricate components. Accordingly, while various aspects are describedherein as employing SLM, also known as direct metal laser melting (DMLM)or laser powder bed fusion (LPBF), other aspects are not so limited, andcan employ any suitable AM technique without departing from the scope ofthe claims.

In this manner, the components described herein can be fabricated usingthe additive manufacturing process, or more specifically each layer canbe successively formed, such as by iteratively sintering metal powderusing laser energy or heat, and fusing the sintered material together.For example, a particular type of additive manufacturing process can usean energy beam, for example, an electron beam or electromagneticradiation such as a laser beam, to sinter or melt a powder material. Anysuitable laser and laser parameters can be used, includingconsiderations with respect to power, laser beam spot size, and scanningvelocity. The build material can be formed by any suitable powder ormaterial selected for enhanced strength, durability, and useful life,particularly at high temperatures.

It will be understood that conventional AM systems generally use a laserdevice, such as a high power-density laser, which can include a controlportion and heat source that produce a laser beam to melt successivelayers of a material such as a metallic powder. More specifically,conventional AM systems use a laser beam to transfer heat to selectedareas of a bed of a powder material, such as a powdered metal, to meltor sinter the selected areas of the powder material with the laser beamto thereby form a melt pool. As the melt pool cools, the melted orsintered material then fuses together to form a solid three-dimensionalobject. The laser beam can be applied to the selected areas of thepowder based on a digital model (e.g., CAD file). The conventional AMsystem will successively add another bed of powder above the firstlayer, and repeat the sintering and fusing process until the object iscompletely formed.

Typically, AM systems (e.g., SLS, DMLS, and SLM) use a laser beam toprovide the thermal energy. However, in various applicable aspects ofthe disclosure, other AM systems employing any desired heat source thatcauses the desired amount or degree of melting or sintering of thepowdered material can be used without departing from the scope of theclaims.

For ease of understanding, the AM systems described herein are describedhaving a single heat source (e.g., a laser beam device). It will beappreciated the aspects of the disclosure are not so limited and caninclude more than one heat source (e.g., more than one laser beamdevice) or alternative heat sources. For example, without limitation, analternative AM system can have a first laser device having a first powerand a second laser device having a second power different from the firstlaser power, an alternative AM system can have at least two laserdevices having substantially the same power output, or the like.However, the AM system can include any combination of laser devices thatpermit the AM system to operate as described herein.

With reference to FIG. 1, an AM system 100 is operated to fabricate alaminated component 500, in a layer-by-layer manufacturing process. Morespecifically, an AM system 100 is operated to fabricate a first portionor first layer 111 of a laminated component 500 (shown in FIG. 8E), suchas a first sheet or first lamina 110 of component 500, in alayer-by-layer manufacturing process.

The first lamina 110 can be fabricated based on an electronicrepresentation of a 3D geometry of first lamina 110. The electronicrepresentation can be produced in a computer-aided design (CAD) orsimilar data (not shown). The design, structure, or the like, of thefirst lamina 110 can be converted into a layer-by-layer format thatincludes a plurality of build parameters for each layer 111, 112 offirst lamina 110. In one non-limiting aspect of the disclosure, thegeometry of first lamina 110 is sliced into a stack of layers of adesired thickness, such that the geometry of each layer is an outline ofthe cross-section through first lamina 110 at that particular layerlocation.

In an aspect, the AM system 100 forms the first lamina 110 byimplementing the layer-by-layer manufacturing method such as a directmetal laser melting method. The exemplary layer-by-layer additivemanufacturing method does not use a pre-existing article as theprecursor to a final component 500, rather the method produces firstlamina 110 from a raw material in a configurable form, such as a powder,for example stored in a powder reservoir.

In the non-limiting aspect depicted in FIG. 1, the AM system 100includes a powder delivery system 58 including a moveable powderdelivery piston 59, powder delivery table 60, and a spreader 62. Amoveable build platform 56 receives a first material 48 in the form of apowder from the powder delivery system 58. The system also includes acontroller module 422 in communication with a conventional laser scannerdevice 425 and heat source 431 to selectively apply a laser beam 432 tothe first material 48 deposited on the build platform 56.

The powder delivery piston 59 can be moveable in a first direction(shown as arrow 61) to advance the powder delivery table 60 to deliverthe first material 48. The build platform 56 receives the first material48 and is moveable in a second direction (shown as arrow 63) toaccommodate an increasing thickness of the first lamina 110 as it isbuilt up. The first material 48 can be spread using the spreader 62,such as a conventional rake, blade, or roller device, to laterallyspread the first material 48 at, across, or overlying the build platform56, the laminae (such as the first lamina 110), or a combinationthereof, to a predetermined thickness. In various aspects, predeterminedthickness may be between 0.001 mm and 0.2 mm. In other aspects, anydesired thickness of powder may be used without departing from the scopeof the disclosure.

In various aspects, the first material 48 can comprise any desiredconductive material. For example, in non-limiting compositions thematerial can comprise a composition of Fe—Si with a percentage byweight, (wt. %) of silicon between 0.1 wt. % and 6.5 wt. %. In othernon-limiting compositions, the material can comprise iron cobalt alloyshaving a composition containing cobalt between 5 wt. % and 50 wt. %,vanadium between 0 wt. % and 2 wt. %, niobium between 0 wt. % and 0.5%,and chromium between 0 wt. % and 1 wt. %. Still other non-limitingcompositions can comprise a powder including iron nickel alloys with acomposition containing nickel between 30 wt. % and 80 wt. %. Othernon-limiting compositions can comprise any number of other conductivecompositions, and can be magnetic or non-magnetic, without departingfrom the aspects of the disclosure explained herein.

In some non-limiting aspects, the first material 48 can comprise a metalalloy that can include iron, cobalt, vanadium, and carbon. In some otheraspects, the metal alloy can include iron, cobalt, vanadium and niobium.In still other aspects, the metal alloy can include iron, cobalt,vanadium, niobium and carbon.

In some aspects, the first material 48 can further includes a firstalloying element present in the range of about 0.001 atomic percent toabout 10 atomic percent selected from the group consisting of boron,aluminum, silicon, germanium, yttrium, titanium, zirconium, hafnium,vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese,rhenium, ruthenium, rhodium, iridium, nickel, palladium, platinum,copper, silver, gold, and combinations thereof, and a second alloyingelement present in the range of about 0.001 atomic percent to about 0.5atomic percent selected from the group consisting of carbon, oxygen,nitrogen, and combinations thereof. In some aspects, the first alloyingelement can be present in a range of about 0.01 atomic percent to about7 atomic percent. In certain embodiments, the first alloying element maybe present in a range of about 0.1 atomic percent to about 5 atomicpercent. In certain aspects, the first material 48 can include vanadium,niobium, carbon and a combination thereof. Vanadium and niobium,individually, may be present in a range of about 0.1 atomic percent toabout 10 atomic percent. In some aspects, vanadium and niobium,individually, may be present in a range of about 0.1 atomic percent toabout 5 atomic percent.

In non-limiting aspects, the first material 48 can comprise particleshaving diameters ranging from, for example, 15 to 45 microns. Otheraspects can comprise a first material 48 comprising particles havingdiameter ranging from 44 to 150 microns.

The conventional laser scanner device 425 is cooperative with the heatsource 431 and arranged to direct the application of a laser beam 432 ina manner to selective locations on the first material 48 deposited onthe build platform 56. The controller module 422 is operative to executeinstructions, based at least on the data defining the component to becreated, to cause the scanner 425, to direct the laser beam 432 topredetermined locations of the first material 48 deposited on the buildplatform 56. The localized heat from laser beam 432 the causes the firstmaterial 48 to melt or sinter at those predetermined locations. Thesintered first material 48 can subsequently cool and fuse to itself tothereby form a desired first layer 111 of the first lamina 110. Excess,unused, or unmelted powder can be brushed, blown, jetted, or blastedaway. Alternatively, excess, unused, or unmelted powder of the firstmaterial 48 can remain in-place at or on the build platform 56 and beutilized as at least a partially supporting structure for future laminaelayering.

In the exemplary aspects described herein, the AM system 100 controllermodule 422 can be any type of controller module. The controller module422 can comprise a computer system that includes at least one processor(not shown) and at least one memory device (not shown) that executesoperations to control the operation of the AM system 100 based at leastpartially on instructions from human operators or digital instruction,including but not limited to data or executable instructions. Controllermodule 422 can include, for example, a 3D model of a part such as firstlamina 110 (or a first insulative layer 113, as shown in 9C) to befabricated by AM system 100. Operations executed by controller module422 can include controlling power output of the heat source 431 andadjusting galvanometers (not shown) to control the speed and directionof the scanner 425 to achieve a selective application, or “pass” of thelaser beam 432 to the first material 48.

In some aspects, the material forming the first lamina 110 can be builtup in a single “pass” or single layer to define the first lamina 110. Inother aspects, the first lamina 110 can be built up in multiplesuccessive “passes” or multiple successive layers to thereby define thefirst lamina 110. In such an aspect, a height of build platform 56 canbe adjusted (e.g., lowered in the second direction 63) between eachsuccessive pass, and the process repeated, until the predeterminedgeometry or a predetermined thickness of the first lamina 110 isachieved. For example, in or at each successive “pass” of forming alayer or lamina (such as the first lamina 110, or successive laminae),the build platform 56 can be lowered or dropped, making room or allowingfor space for the following or subsequent layer or lamina.

With reference to FIG. 2, the height of the build platform 56 can beadjusted in the second direction 63 (e.g., lowered) and the process canbe repeated to build the next, successive, or second layer 112 orportion of the first lamina 110. That is, following a like process asdescribed herein to build the first layer 111 of the first lamina 110, anew or second layer of the first material 48 can be deposited by thepowder delivery system 58. However, rather than depositing the firstmaterial 48 directly onto the build table 56, the first material 48 isinstead deposited onto a surface 101 (e.g. a top surface) of the firstlayer 111 of the first lamina 110 when supported by the build platform56, and spread using the spreader 62 to a predetermined thickness. Theheat source 431 and scanner 425 then cooperatively position the laserbeam 432 to provide heat to selective portions of the second layer offirst material 48 causing the first material 48 to completely or atleast partially melt at those selective locations. As the melted firstmaterial 48 cools, it subsequently fuses to itself, and to the firstlayer 111 of the first lamina 110, to thereby form a second layer 112 ofthe first lamina 110. This process is repeated until all desired layersof the first lamina 110 are printed, that is, until a predeterminedthickness or geometry of the first lamina 110 is reached. For example,in various aspects of the disclosure, the predetermined thickness of thefirst lamina can be in the range of 0.05 mm to 5 mm. Again, any excess,unused, or unmelted powder can be brushed, blown, jetted, or blastedaway, or remain in-place, in-between successive layering or meltingcycles.

For ease of understanding, with reference to FIGS. 8A and 8B, the methodof building or forming the first lamina 110 is described herein usingtwo layers 111, 112. However, it will be appreciated that any number oflayers, including only one, having any desired thickness can be usedwithout departing from the scope of the claims in order to build thefirst lamina 110 to a predetermined thickness. Additionally, in aspectsof the disclosure, each independent layer 111, 112 can comprise anidentical thickness, or different thicknesses, compared to any otherlayer 111, 112 of the first lamina 110.

Once the first lamina 110 is formed, a first insulative layer 113comprising a second material 72 can be formed thereon. For example, withreference to FIG. 8C, the first lamina 110 can define a first surface102, (e.g. a top surface) and first insulative layer 113 can be built upon the first surface 102 (e.g., the top surface 102 of first lamina110). The second material 72 comprising the first insulative layer 113is deposited directly onto the first surface 102 of the first lamina110. The first lamina 110 can be adjustably supported by the buildplatform 56 as the second material 72 is applied or deposited on thefirst surface 102.

In non-limiting aspects, the first insulative layer 113 can be formedvia a conventional material jetting process. In other aspects, thesecond material 72 forming the first insulative layer 113 can bedeposited using a conventional aerosol jet spray deposition process. Inyet other aspects, the first insulative layer 113 can be formed via alayer-by-layer manufacturing method such as a direct metal laser meltingmethod. For example, in some aspects, the first insulative layer 113 canbe formed using the same method as used to build the first lamina 110.For ease of understanding, aspects of the first insulative layer 113 aredepicted schematically in FIG. 3 as being formed via a material jettingprocess, and aspects of the first insulative layer 113 are depictedschematically in FIG. 4 as being formed via a layer-by-layermanufacturing method such as a direct metal laser melting method.Regardless of the method used to build the first insulative layer,non-limiting aspects can include a subsequent sintering of the firstinsulative layer 113.

With reference to FIG. 3, in one exemplary aspect, the second material72 can be applied or formed on the first surface 102 (e.g., a topsurface) of the first lamina 110, using a conventional material jettingsystem 525. For example, the material jetting system 525 can include aprint head 531 and a conventional positioning (for example a grid-type,or X—Y—Z type) system 540, which are cooperative with the controllermodule 422 to apply the second material 72 onto the first surface 102.The print head 531 can be moveable via the positioning system 540. Thesecond material 72 can be deposited using any convenient type ofmaterial application or print head 531, such as a conventional materialjet print head, a piezoelectric print head, or a thermal print head. Forexample, without limitation, a conventional liquid metal jet (LMJ) printhead can be used to propel the second material 72 to form the firstinsulative layer 113 on the first lamina 110.

In some aspects, a single print head 531 can be used to deposit thematerial forming the first insulative layer 113 onto the first lamina110. Other aspects can comprise multiple print heads 531 tocooperatively deposit the second material 72.

In a non-limiting aspect, the print head 531 can be moveable via theconventional positioning system 540, which can be communicativelycoupled to the controller module 422. The controller module 422 caninclude, for example, a 3D model of a part such as the first insulativelayer 113 to be fabricated by AM system 100. Operations executed bycontroller module 422 can include controlling the speed and direction ofthe positioning system 540 and print head 531 to achieve a selectiveapplication, or “pass” of the second material 72 to form the firstinsulative layer 113. In some aspects, the material forming the firstinsulative layer 113 can be built up in a single “pass” or single layerto define the first insulative layer 113. In other aspects, the firstinsulative layer 113 can be built up in multiple successive “passes” ormultiple successive layers to thereby define the first insulative layer113.

In various aspects, the second material 72 can comprise any desiredmaterial without departing from the aspects described herein.Additionally, in non-limiting aspects, the second material 72 canoptionally include (for example, by pre-mixing) a conventional binder orbinder solution (not shown). In other aspects, a binder can be appliedto the first insulative layer 113 via a conventional binder jet process(not shown). It will be appreciated that in various aspects, the secondmaterial 72 may comprise any one of a solid, a slurry, and a liquid.

In non-limiting aspects, when the second material 72 is deposited on thefirst surface 102, it is an electrically insulative material. In onenon-limiting aspect, the material can comprise a mixture of aluminumoxide and titanium carbide composites. In other aspects, the materialcan comprise a mixture of aluminum oxide and zirconium dioxide. In someaspects, the second material 72 can be a ceramic material. For example,the second material 72 can include, without limitation aluminum oxide(Al₂O₃), silicon carbide (SiC), silicon dioxide (SiO₂), magnesium oxide(MgO), zirconium dioxide (ZrO₂), yttria stabilized zirconia (YSZ),Silicon Nitride (Si₃N₄), aluminum nitride (AlN), boron carbide (B₄C),and boron nitride (BN), individually, or in various combinationsthereof. Additionally, the second material 72 can comprise any of glassand glass ceramics, such as Borosilicate glass, quartz,alumino-silicates, silicate ceramics, or magnesium silicatesindividually, or in various combinations thereof. In still othernon-limiting aspects, the second material 72 can include non-binaryceramics such as aluminum titanate (Al₂TiO₅), barium titanate (BaTiO₃),or zirconium titanate (ZrTiO₄) individually, or in various combinationsthereof. In yet other non-limiting aspects, the second material 72 caninclude conductive ceramics such as carbides, borides, nitrides,silicides of d-block elements., including for example, titanium oxides(TiO_(x), where x<1), titanium carbides (TiC_(x)), titanium nitrides(TiN_(x)), titanium boride (TiB₂), zirconium diboride (ZrB₂), hafniumdiboride (HfB₂), tungsten carbide (WC), molybdenum disilicide (MoSi₂).

Moreover, to enhance the wettability or bonding ability of suchinsulative materials (i.e., to the first lamina 110), at least one ofthe first material 48 and the second material 72 may further optionallycomprise a reactive element. For example, in a non-limiting aspect, thereactive element can comprise any of chromium (Cr), titanium (Ti),zirconium (Zr), hafnium (Hf), vanadium (V), or palladium (Pd),individually, or in various combinations thereof. In an aspect, thereactive metal can be pre-mixed or otherwise included with the firstmaterial 48 when printing the first lamina 110. In other aspects, thereactive element can be deposited on one of the first lamina 110 or thefirst insulative layer 113 through any number of conventional depositiontechniques such as sputter deposition or physical vapor deposition. Thereactive element is operative to react and bond with the second material72 and the first material 48.

In other non-limiting aspects, when the second material 72 comprisingthe first insulative layer 113 is deposited on the first surface 102, itcan be an electrically conductive material. In still other non-limitingaspects, when the second material 72 comprising the first insulativelayer 113 is deposited on the first surface 102, it is an electricallysemi-conductive material. In still other non-limiting aspects, thesecond material 72 comprising the first insulative layer 113 can be thesame material used to form the first lamina 110.

For example, in non-limiting compositions the second material 72 cancomprise a composition of Fe—Si with a percentage by weight, (wt. %) ofsilicon between 0.1 wt. % and 6.5 wt. %. In other non-limitingcompositions, the second material 72 can comprise iron cobalt alloyshaving a composition containing cobalt between 5 wt. % and 50 wt. %,vanadium between 0 wt. % and 2 wt. %, niobium between 0 wt. % and 0.5%,and chromium between 0 wt. % and 1 wt. %. Still other non-limitingcompositions of the second material 72 can comprise a powder includingiron nickel alloys with a composition containing nickel between 30 wt. %and 80 wt. %. Other non-limiting compositions of second material 72 cancomprise any number of other conductive compositions, and can bemagnetic or non-magnetic, without departing from the aspects of thedisclosure explained herein.

In some non-limiting aspects, the second material 72 can comprise ametal alloy that can include iron, cobalt, vanadium, and carbon. In someother aspects, the metal alloy can include iron, cobalt, vanadium andniobium. In still other aspects, the metal alloy can include iron,cobalt, vanadium, niobium and carbon.

In some aspects, the second material 72 can further include a firstalloying element present in the range of about 0.001 atomic percent toabout 10 atomic percent selected from the group consisting of boron,aluminum, silicon, germanium, yttrium, titanium, zirconium, hafnium,vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese,rhenium, ruthenium, rhodium, iridium, nickel, palladium, platinum,copper, silver, gold, and combinations thereof, and a second alloyingelement present in the range of about 0.001 atomic percent to about 0.5atomic percent selected from the group consisting of carbon, oxygen,nitrogen, and combinations thereof. In some aspects, the first alloyingelement can be present in a range of about 0.01 atomic percent to about7 atomic percent. In certain embodiments, the first alloying element maybe present in a range of about 0.1 atomic percent to about 5 atomicpercent. In certain aspects, the second material 72 can includevanadium, niobium, carbon and a combination thereof. Vanadium andniobium, individually, may be present in a range of about 0.1 atomicpercent to about 10 atomic percent. In some aspects, vanadium andniobium, individually, may be present in a range of about 0.1 atomicpercent to about 5 atomic percent.

In non-limiting aspects, the second material 72 used to build or formthe first insulative layer 113 can be deposited as relatively smallspherical droplets or particles. For example, the second material 72forming the first insulative layer 113 can comprise particles of thehaving sizes of less than 15 microns. In other non-limiting aspects, thesecond material 72 can comprise particles having diameters ranging from,for example, 15 to 45 microns. Still other aspects can include a secondmaterial 72 comprising particles having diameter ranging from 44 to 150microns. In other aspects, the second material 72 forming the firstinsulative layer 113 can comprise any desired particle size withoutdeparting from aspects of the disclosure described herein. Referring nowto FIG. 4, an alternative aspect of forming the first insulative layervia a layer-by-layer manufacturing method such as a direct metal lasermelting method is shown. In a similar arrangement to that used to formthe first lamina 110, the first insulative layer 113 may likewise bebuilt up on the first surface 102, (e.g. a top surface) of the firstlamina 110.

For example, the conventional powder delivery system 58 powder deliverypiston 59 can move in the first direction 61 to advance the powderdelivery table 60 to deliver the second material 72 in powder form. Theheight of the build platform 56 can be adjusted in the second direction63 (e.g., lowered) and the second material 72 forming the firstinsulative layer 113 can be deposited on the first surface 102 of firstlamina 110. The powder second material 72 can be arranged using thespreader 62 to a predetermined thickness across the first surface 102(e.g., the top surface of first lamina 110).

That is, in an aspect, following a like process as described herein tobuild the first lamina 110, a layer of the second material 72 in theform of a metal powder can be deposited by the powder delivery system 58onto the first surface 102 of the first lamina 110 when supported by thebuild platform 56, and spread using the spreader 62 to a predeterminedthickness. The scanner 425 can then cooperatively position the laserbeam 432 to provide heat to selective portions of the layer of thesecond material 72 causing the metal powder to completely or at leastpartially melt at those selective locations. As the melted powder ofsecond material 72 at the selective location cools, it subsequentlyfuses to itself, and to the first lamina 110 to thereby form the firstinsulative layer 113 thereon. This process is repeated until all desiredlayers of the first insulative layer 113 are printed, that is, until apredetermined thickness or geometry of the first insulative layer 113 isreached. For example, the build platform 56 can be lowered or dropped,making room or allowing for space for an additional layer of secondmaterial 72 to be added onto the prior layer of second material 72. Itwill be appreciated that any number of layers having any desiredthickness can be used without departing from the scope of the claims inorder to build the first insulative layer 113 to a predeterminedthickness. Again, any excess, unused, or unmelted powder of the secondmaterial 72 can be brushed, blown, jetted, or blasted away, or remainin-place, in-between successive layering or melting cycles.

In an aspect, once the second material 72 is deposited or built-up, andit is determined to have reached a desired or predetermined thickness,the second material 72 can then be sintered to define the firstinsulative layer 113. Additionally, in some aspects, the depositedsecond material 72 can be further treated such as by a heat treatment.In still other aspects, the second material 72 can be additionally oralternatively be chemically treated. As will be described in more detailherein, the treatment can vary in dependence upon the physicalproperties of the second material 72 used to form the first insulativelayer 113. In some aspects, the treatment reduces the electricalconductivity of the first insulative layer 113. In some aspects, thetreatment causes the material forming the first insulative layer 113 tobecome electrically non-conductive.

For example, in a non-limiting aspect, the first insulative layer 113can be built up using a non-conductive second material 72, and in theevent it is determined to have reached a predetermined thickness, aconventional laser sintering process can be applied to the secondmaterial 72 to thereby define the first insulative layer 113. In otheraspects, the first insulative layer 113 can be built up using aconductive second material 72. In the event it is determined theconductive second material 72 has reached a predetermined thickness, thebuilt-up conductive second material 72 can be sintered via aconventional laser sintering process, and then selectively treated viaat least one of a heat treatment and a chemical treatment to reduce theconductivity of the second material 72 such that it becomes insulative,and thereby define the first insulative layer 113. It will beappreciated that the specific sintering process characteristics (forexample, the laser power level, scanning speed, etc.) will differ independence upon the physical characteristics of selected second material72.

The AM system 100 can comprise any number of conventional sinteringmethods such as laser sintering or chemical sintering to define thefirst insulative layer 113. As will be understood, in other aspects, theconventional laser or chemical sintering process can further include aconventional heat-treating process.

For example, as depicted in FIG. 4 a laser beam 432 can be selectivelyapplied to the second material 72 forming the first insulative layer 113to thereby sinter selective portions thereof to thereby define the firstinsulative layer 113. A conventional laser scanner device 425 can bearranged to cooperate with the control module 422 to direct theapplication of a laser beam 432 in a known manner to selective locationson the first insulative layer 113. The controller module 422 can beoperative to execute instructions, based on data defining the firstinsulative layer 113, to cause the scanner 425 and heat source 431, todirect the laser beam 432 to predetermined locations of the firstinsulative layer 113. The localized heat from laser beam 432 sinters thesecond material 72 at those predetermined locations thereby defining thefirst insulative layer 113.

In other aspects, with reference to FIG. 5, in addition to sintering,the first insulative layer 113 may further be selectively treated toreduce its electrical conductivity and define the first insulative layer113 via a chemical treatment. For example, in some aspects the secondmaterial 72 can be treated via a conventional plasma surface treatment.In various non-limiting aspects, a conventional atmospheric-pressureplasma device 428, such as for example, an electric arc, coronadischarge, dielectric barrier discharge, or piezoelectric directdischarge, can provide a plasma jet 434.

In one non-limiting example, a high-voltage discharge (e.g., 5-15 kV,10-100 kHz) pulsed electric arc (not shown) can be generated by theplasma device 428 to excite a process gas (for example, compressed air)and convert it to the a plasma jet 434. The plasma is passed through aconventional plasma jet head 437 and selectively applied to treat thedeposited second material 72 and thereby reduce its conductivity.

It will be understood that the exemplary aspect employing an atmosphericpressure plasma device 428 is provided by way of non-limiting exampleonly. Any number of alternative plasma surface treatment devices andmethods may be used within the scope of the claims herein. Regardless ofthe type of plasma or chemical treatment used, the selective treatmentreduces the electrical conductivity of the second insulative layer 113.In some aspects, the selective oxygen plasma treatment causes thematerial forming the first insulative layer 113 to become electricallynon-conductive.

For example, in an aspect, the first insulative layer 113 is formedusing a non-conductive second material 72, and in the event it isdetermined to have reached a predetermined thickness, a conventionalchemical treatment process can be applied to the second material 72 tothereby define the first insulative layer 113. In another aspect, thefirst insulative layer 113 can be built up using a conductive secondmaterial 72. In the event it is determined the second material 72 hasreached a predetermined thickness, the built up conductive secondmaterial 72 can then be selectively treated via a conventional plasmasurface treatment, to reduce the conductivity of the second material 72such that it becomes insulative, and thereby define the first insulativelayer 113.

For example, a conventional plasma jet 434 can be selectively applied tothe second material 72 forming the first insulative layer 113 to therebytreat predetermined portions thereof to thereby define the firstinsulative layer 113. A conventional plasma device 428 can cooperatewith the controller module 422 to direct the application of the plasmajet 434 in a known manner to selective locations on the second material72 forming the first insulative layer 113. The controller module 422 canbe operative to execute instructions, based on data defining the firstinsulative layer 113, to cause the plasma device 428 to direct theplasma jet 434 to predetermined locations of the second material 72. Thelocalized plasma treatment from plasma jet 434 reduces the conductivityof the second material 72 at those predetermined locations therebydefining the first insulative layer 113.

As will be understood, in other aspects, the conventional chemicaltreatment process can further include a conventional heat-treatingprocess. For example, a second heat source 533 (FIG. 3), such as a UVlight source or infrared light source, may be used to heat the firstinsulative layer 113 prior to, or subsequent to the chemical treatmentor sintering.

With reference to FIGS. 8D-8E, once the first insulative layer 113 isformed and treated (e.g., sintered), a conductive second lamina 210 canbe formed thereon. For example, the first insulative layer 113 candefine a second surface 103, (e.g. a top surface) and the second lamina210 can be formed thereon. A third material 49 comprising the conductivesecond lamina 210 is deposited directly onto the second surface 103 ofthe first insulative layer 113.

The AM system 100 can be used to build a second sheet or lamina 210 ofcomponent 500, in a layer-by-layer manufacturing process. The secondlamina 210 can be fabricated in a manner identical to or differentlyfrom that used to build the first lamina 110. For example, the secondlamina 210 can be built based on an electronic representation of a 3Dgeometry of second lamina 210. The electronic representation can beproduced in a computer-aided design (CAD) or similar file (not shown).The CAD file of the second lamina 210 can be converted into alayer-by-layer format that includes a plurality of build parameters foreach layer of second lamina 210. In an aspect, the geometry of secondlamina 210 is sliced into a stack of layers of a desired thickness, suchthat the geometry of each layer is an outline of the cross-sectionthrough second lamina 210 at that particular layer location.

Referring now to FIG. 6, the AM system 100 can be operated to form thesecond lamina 210 by implementing a layer-by-layer manufacturing method(for example, a direct metal laser melting method). The exemplarylayer-by-layer additive manufacturing method does not use a pre-existingarticle as the precursor to a final component 500, rather the methodproduces second lamina 210 from a raw third material 49 in aconfigurable form, such as a powder. For example, without limitation, asteel second lamina 210 can be additively manufactured using a steelpowder.

The powder delivery system 58 can advance the powder delivery table 60in the first direction 61 using piston 59 to deliver the third material49. The build platform 56 receives the third material 49 and is moveablein a second direction 63 to accommodate an increasing thickness of thesecond lamina 210 as it is built up. The third material 49 can bearranged using the spreader 62, to laterally spread a predeterminedthickness of the third material 49 across the build platform 56. Theconventional laser scanner device 425 is arranged to direct theapplication of laser beam 432 in a known manner to selective locationson the deposited third material 49. The controller module 422 isoperative to execute instructions, based at least on the data definingthe component to be created, to cause the scanner 425 and heat source431, to cooperatively direct the laser beam 432 to predeterminedlocations of the spread third material 49 on the build platform 56. Thelocalized heat from laser beam 432 causes the third material 49 to meltor sinter at those locations. The melted or sintered third material 49can subsequently fuse to itself and thereby form a desired first layer211 of the second lamina 210, for example.

The controller module 422 can include, for example, a 3D model of a partsuch as second lamina 210 to be fabricated by AM system 100. Operationsexecuted by controller module 422 can include controlling power outputof the heat source 431 and adjusting galvanometers (not shown) tocontrol the speed and direction of the scanner 425 to achieve aselective application, or “pass” of the laser beam 432 to the firstmaterial 48.

In some aspects, the material forming the second lamina 210 can beformed or built in a single pass or single layer to define the secondlamina 210. In other aspects, the second lamina 210 can be built up inmultiple successive passes or multiple successive layers to therebydefine the second lamina 210. In such an aspect, a height of a print bedor build platform 56 can be adjusted between each successive pass, andthe process repeated, until the predetermined geometry or apredetermined thickness of the first lamina is achieved. In such anaspect, a height of build platform 56 can be adjusted between eachsuccessive pass, and the process repeated, until the predeterminedgeometry or a predetermined thickness of the second lamina 210 isachieved. For example, in or at each successive “pass” of forming alayer or lamina (such as the second lamina 210, or successive laminae),the build platform 56 can be lowered or dropped, making room or allowingfor space for the following layer or lamina.

The build process of the second lamina 210 begins by spreading arelatively thin (e.g., between 0.001 mm and 0.2 mm) layer of a desiredthird material 49 onto the second surface 103 of the first insulativelayer 113. In an aspect, the third material 49 used to build the secondlamina 210 can be identical to the first material 48 used to build thefirst lamina. In other aspects, a different conductive third material 49can be used. In some aspects the third material can be selected from Invarious aspects, the third material 49 can comprise any desiredmaterial. For example, in non-limiting compositions the material cancomprise a composition of Fe—Si with a percentage by weight, (wt. %) ofsilicon between 0.1 wt. % and 6.5 wt. %. In other non-limitingcompositions, the material can comprise iron cobalt alloys having acomposition containing cobalt between 5 wt. % and 50 wt. %, vanadiumbetween 0 wt. % and 2 wt. %, niobium between 0 wt. % and 0.5%, andchromium between 0 wt. % and 1 wt. %. Still other non-limitingcompositions can comprise a powder including iron nickel alloys with acomposition containing nickel between 30 wt. % and 80 wt. %. Othernon-limiting compositions can comprise any number of other conductivecompositions, and can be magnetic or non-magnetic, without departingfrom the aspects of the disclosure explained herein.

In some non-limiting aspects, the third material 49 can comprise a metalalloy that can include iron, cobalt, vanadium, and carbon. In some otheraspects, the metal alloy can include iron, cobalt, vanadium and niobium.In still other aspects, the metal alloy can include iron, cobalt,vanadium, niobium and carbon.

In some aspects, the third material 49 can further includes a firstalloying element present in the range of about 0.001 atomic percent toabout 10 atomic percent selected from the group consisting of boron,aluminum, silicon, germanium, yttrium, titanium, zirconium, hafnium,vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese,rhenium, ruthenium, rhodium, iridium, nickel, palladium, platinum,copper, silver, gold, and combinations thereof, and a second alloyingelement present in the range of about 0.001 atomic percent to about 0.5atomic percent selected from the group consisting of carbon, oxygen,nitrogen, and combinations thereof. In some aspects, the first alloyingelement can be present in a range of about 0.01 atomic percent to about7 atomic percent. In certain embodiments, the first alloying element maybe present in a range of about 0.1 atomic percent to about 5 atomicpercent. In certain aspects, the third material 49 can include vanadium,niobium, carbon and a combination thereof. Vanadium and niobium,individually, may be present in a range of about 0.1 atomic percent toabout 10 atomic percent. In some aspects, vanadium and niobium,individually, may be present in a range of about 0.1 atomic percent toabout 5 atomic percent.

In non-limiting aspects, the third material 49 can comprise particleshaving diameters ranging from, for example, 15 to 45 microns. Otheraspects can comprise a third material 49 comprising particles havingdiameter ranging from 44 to 150 microns.

The build platform 56 is moveable in a second direction 63 toaccommodate an increasing thickness of the second lamina 210 as it isbuilt. The controller module 422 can then execute instructions to directa scanner 425 and a heat source 431, to cooperatively provide sufficientheat via a laser 432 or electron beam to the third material 49 on thebuild platform to completely or at least partially melt the firstmaterial 48 and enable the third material 49 to fuse to itself andthereby form a desired first layer 211 of the second lamina 210 based atleast on the data in the CAD file. The height of the build platform 56can then be adjusted in the second direction 63 (e.g., lowered) and theprocess is repeated to build a next or second layer 212 or portion ofthe second lamina 210. That is, a new or second layer 212 of thirdmaterial 49 is deposited onto a surface 104 (e.g. a top surface) of thefirst layer 211 of the second lamina 210 supported by the build platform56, and arranged using the spreader 62 to a desired thickness. The heatsource 431 and scanner 425 then cooperatively heat the second layer ofthird material 49 via laser 432 or electron beam causing the thirdmaterial 49 to completely or at least partially melt and fuse to itselfand to the first layer 211 of the second lamina 210, to thereby form asecond layer 212 of the second lamina 210. This process is repeateduntil all desired layers of the second lamina 210 are printed, that is,a predetermined thickness or geometry of the second lamina 210 isreached. Again, excess, unused, or unmelted third material 49 can bebrushed, blown, jetted, or blasted away, or remain in-place, in-betweensuccessive layering or melting cycles.

For ease of understanding, the method of building or forming the secondlamina 210 is described herein using two layers 211, 212. However, itwill be appreciated that any number of layers having any desiredthickness can be used without departing from the scope of the claims inorder to build the second lamina 210 to a predetermined thickness.Additionally, in some aspects, each layer 211, 212 can comprise anidentical thickness, or different thicknesses compared to any otherlayer 211, 212 forming the second lamina 210. When the desired thicknessof the component 500 is reached, it can be removed from the build table56. In various aspects, when fabricated, the laminated component 500 canbe further heat treated using any conventional heat treatment process.

It will be appreciated that the heat treatment process can be applied inbulk (that is a heat treatment applied to a fully assembled laminatedcomponent 500. In other aspects the heat treatment can comprise alayer-by-layer heat treatment (that is after each layer is built, as thelaminated component 500 is being formed).

A method 800 of forming a laminated component 500 in accordance with anon-limiting aspect is shown in FIG. 9. The sequence depicted is forillustrative purposes only and is not meant to limit the method 800 inany way as it is understood that the portions of the method can proceedin a different logical order, additional or intervening portions can beincluded, or described portions of the method can be divided intomultiple portions, or described portions of the method can be omittedwithout detracting from the described method.

The method 800 begins at 810 by forming a first lamina or sheet with aconductive first material, for example by using an additivemanufacturing process. In an aspect, at step 815, the first lamina canbe formed by depositing a layer of a powdered conductive first material.In one non-limiting aspect, the conductive first material can be amagnetic material such as cobalt iron. In some aspects, the conductivefirst material is deposited on a supportive surface such as a buildtable. At 820, the first lamina can be further formed by selectivelysintering the deposited conductive first material, for example using aconventional metal laser sintering process. At 830, it is determinedwhether the first lamina has reached a predetermined thickness. In theevent the first lamina has not reached the predetermined thickness,steps 815 and 820 can be repeated, that is, the first material isdeposited on the previously deposited layer of the first material tobuild it up or further increase its thickness. In an aspect, the newlyadded first material can be selectively sintered, for example using aconventional metal laser sintering process.

At 830, in the event it is determined the first lamina has reached apredetermined thickness, the method continues by forming a firstinsulation layer, at 840. In an aspect, the forming the first insulationlayer can comprise, at 845, depositing a second material on a topsurface of the first lamina until a desired thickness of the secondmaterial is reached. The second material can be in the form of a powder.In other aspects, the second material can be in the form of a slurry ora liquid. The second material can be deposited using a conventionalmaterial jetting process. In still other aspects, the material can bedeposited using a conventional aerosol jet spray deposition process.

Once the second material forming the first insulative layer isdeposited, then, at 850 the first insulative layer is treated, forexample using a conventional metal laser sintering process.

The method 800 continues at 860 by forming a second lamina or sheet witha conductive third material, for example by using an additivemanufacturing process. In an aspect, at 865, the conductive thirdmaterial can be deposited on a top surface of the first insulativelayer. In one non-limiting aspect, the conductive first material can bea magnetic material such as cobalt iron. In some aspects, the conductivethird material is the same composition as the conductive first material.At 870, the second lamina is further formed by selectively sintering thedeposited conductive third material, for example using a conventionalmetal laser sintering process. At 880, it is determined whether thesecond lamina has reached a predetermined thickness. In the event thesecond lamina has not reached the predetermined thickness, steps 865 and870 are repeated, that is, the third material is again deposited on asurface of the second lamina to build it up or further increase itsthickness, and the newly added third material is selectively sintered,for example using a conventional metal laser sintering process.

In some aspects, at 890, it is determined whether a desired orpredetermined total thickness of the laminated component 500 has beenreached. Alternatively, at 890 it can be determined whether a desired orpredetermined number of lamination layers, insulation layers, or both,has been reached. In the event it is determined that the total thicknessof the laminated component 500, the number of lamination layers,insulation layers, has not been reached, the process 800 can beselectively repeated. For example, if at 890, it is determined thepredetermined total thickness of the laminated component 500 has notbeen reached, steps 840 and 860 can be iteratively repeated until thepredetermined total thickness of the laminated component is reached. Invarious aspects, the steps 810, 840, 860 can be done in any order, orskipped, or repeated as desired to form the laminated component 500 asdesired without departing from the scope of the disclosure. Accordingly,the laminated component 500 formed by method 800 can have any desirednumber, and any desired order, of alternating first lamina, firstinsulating layer, and second lamina.

Another non-limiting aspect of a method 900 of forming a laminatedcomponent 500 is shown in FIG. 10. One notable difference between themethod 900 and the method 800 described herein is that in addition tousing a conventional sintering process on the second material depositedto form the first insulative layer (as in aspects of method 800),aspects of method 900 can additionally include a heat treating or aconventional chemical treating process to reduce the conductivity of thefirst insulative layer. The non-limiting sequence as depicted in FIG. 10is for illustrative purposes only and is not meant to limit the method900 in any way as it is understood that the portions of the method canproceed in a different logical order, additional or intervening portionscan be included, or described portions of the method can be divided intomultiple portions, or described portions of the method can be omittedwithout detracting from the described method.

The method 900 begins at 910 by forming a first lamina or sheet with aconductive first material, such as by using an additive manufacturingprocess. For example, various aspects may form the first lamia usingconventional Direct Metal Laser Melting (DMLM) techniques. Other aspectsmay employ conventional laser powder bed fusion (LPBF) techniques. Stillother aspects may employ any other desired AM technique to form thefirst lamina without departing from the scope of the disclosure. In anaspect, at step 915, the first lamina can be formed by depositing apowdered conductive first material. In one non-limiting aspect, theconductive first material can be a magnetic material such as cobaltiron. In some aspects, the conductive first material is deposited on asupportive surface such as a build table. At 920, the first lamina isfurther formed by selectively sintering the deposited conductive firstmaterial, for example using a conventional metal laser sinteringprocess. At 930, it is determined whether the first lamina has reached apredetermined thickness. In the event the first lamina has not reachedthe predetermined thickness, steps 915 and 920 are repeated, that is,the first material is deposited on a surface of the first lamina tobuild it up or further increase its thickness, and the newly added firstmaterial is selectively sintered, for example using a conventional metallaser sintering process.

At 930, in the event it is determined the first lamina has reached apredetermined thickness, the method continues with a building up of afirst insulation layer at 940. In an aspect, the building of the firstinsulative layer can comprise using an additive manufacturing process.For example, the conductive material can be built up using aconventional DMLM techniques. Other aspects may employ conventional LPBFtechniques. Still other aspects may employ any other desired AMtechnique to form the first insulative layer without departing from thescope of the disclosure. In an aspect, at 945, second material isdeposited on a first surface of the first lamina until a desiredthickness of the second material is reached. In an aspect, the secondmaterial can be a conductive material such as a powdered metal.

Once the second material forming the first insulative layer is depositedin 945, then at 947, the first insulative layer is sintered, for examplevia a conventional laser sintering process. Next, at 950, the sinteredfirst insulative layer is treated, for example using a conventionalchemical treatment process to reduce the conductivity of the secondmaterial of the first insulative layer. In some aspects the chemicaltreatment can be surface plasma treatment. In some aspects, theconventional chemical treatment process can further comprise aheat-treating process.

The method 900 continues at 860 by forming a second lamina or sheet withthe conductive third material, for example by using an additivemanufacturing process. In an aspect, the second lamina can be formedusing the same process that was used to form the first lamina. In anaspect, at 965, the conductive third material can be deposited on asurface of the first insulative layer. In one non-limiting aspect, theconductive third material can be a magnetic material such as cobaltiron. In some aspects, the conductive third material is the samecomposition as the conductive first material. At 970, the second laminais further formed by selectively sintering the deposited conductivethird material, for example using a conventional metal laser sinteringprocess. At 980, it is determined whether the second lamina has reacheda predetermined thickness. In the event the second lamina has notreached the predetermined thickness, steps 965 and 970 can be repeated,that is, the third material can be deposited on a surface of the secondlamina to build it up or further increase its thickness, and the newlyadded third material can be sintered, for example using a conventionalmetal laser sintering process.

In some aspects, at 990, it is determined whether a desired orpredetermined total thickness of the laminated component 500 has beenreached. Alternatively, at 990 it can be determined whether a desired orpredetermined number of lamination layers, insulation layers, or both,has been reached. In the event it is determined that the total thicknessof the laminated component 500, the number of lamination layers,insulation layers, has not been reached, the process 900 can berepeated. For example, if at 990, it is determined the predeterminedtotal thickness of the laminated component 500 has not been reached,steps 940 and 960 can be iteratively repeated until the predeterminedtotal thickness of the laminated is reached. In various aspects, thesteps 910, 940, 960 can be done in any order, or skipped, or repeated asdesired to form the laminated component 500 as desired without departingfrom the scope of the disclosure. Accordingly, the laminated component500 formed by method 900 can have any desired numbers of alternatingfirst lamina, first insulating layer, and second lamina.

The aspects disclosed herein provide ferromagnetic device and method ofmaking. The technical effect is that the above described aspects enablefabrication of a laminated electromagnetic device. Another technicaleffect is that because mechanical joints and connections are reducedover the prior art, an improved thermal and mechanical performance ofthe core is attained. Complex geometries, including cores havingbuilt-in or integral cooling channels, are also enabled resulting inimproved performance. An additional technical effect that is realized inthe above aspects is that the above described aspects result in areduced core weight with a higher power density than compared withconventional systems.

To the extent not already described, the different features andstructures of the various aspects can be used in combination with eachother as desired. That one feature cannot be illustrated in all of theaspects is not meant to be construed that it cannot be, but is done forbrevity of description. Thus, the various features of the differentaspects can be mixed and matched as desired to form new aspects, whetheror not the new aspects are expressly described. Combinations orpermutations of features described herein are covered by thisdisclosure.

This written description uses examples to disclose aspects of thedisclosure, including the best mode, and also to enable any personskilled in the art to practice aspects of the disclosure, includingmaking and using any devices or systems and performing any incorporatedmethods. The patentable scope of the disclosure is defined by theclaims, and can include other examples that occur to those skilled inthe art. Such other examples are intended to be within the scope of theclaims if they have structural elements that do not differ from theliteral language of the claims, or if they include equivalent structuralelements with insubstantial differences from the literal languages ofthe claims.

Further aspects of the invention are provided by the subject matter ofthe following clauses:

1. A method of making a component of an electric machine, comprising:forming a first lamina of a conductive first material; depositing asecond material on a first surface of the first lamina; treating thesecond material to thereby define a first insulative layer; and forming,on the first insulative layer, a second lamina of a conductive thirdmaterial.

2. The method of any preceding clause wherein the forming of the firstand second lamina comprises depositing a metal powder, on a buildsurface and the first insulative layer, respectively, and sintering themetal powder.

3. The method of any preceding clause wherein the depositing andsintering steps are iteratively repeated until the first and secondlamina reach a predetermined respective thickness.

4. The method of any preceding clause wherein the second materialfurther comprises a binder material.

5. The method of any preceding clause wherein the treating stepcomprises a sintering.

6. The method of any preceding clause, wherein the second material is anelectrically conductive material.

7. The method of any preceding clause wherein treating step furtherincludes at least one of a chemical treatment and a heat treatment.

8. The method of any preceding clause wherein the treating step reducesthe conductivity of the second material.

9. The method of any preceding clause wherein the second materialcomprises wherein the second material comprises at least one of aluminumoxide (Al2O3), silicon carbide (SiC), silicon dioxide (SiO2), magnesiumoxide (MgO), zirconium dioxide (ZrO2), yttria stabilized zirconia (YSZ),Silicon Nitride (Si3N4), aluminum nitride (AlN), boron carbide (B4C),and boron nitride (BN), glass, borosilicate glass, quartz,alumino-silicates, silicate ceramics, magnesium silicates, aluminumtitanate (Al2TiO5), barium titanate (BaTiO3), or zirconium titanate(ZrTiO4) individually, or in combinations thereof.

10. The method of any preceding clause wherein the chemical treatment isa plasma surface treatment.

11. The method of any preceding clause further including the step ofheat treating the first insulative layer.

12. The method of any preceding clause wherein the sintering is a lasersintering.

13. The method of any preceding clause wherein the first conductivematerial is magnetic.

14. The method of any preceding clause wherein the conductive firstmaterial is a different composition from the conductive third material.

15. An additive manufacturing system configured to form a first laminaof a conductive first material; deposit a second material on a firstsurface of the first lamina; treat the second material to thereby definea first insulative layer; and form, on the first insulative layer, asecond lamina of a conductive third material.

16. The system of any preceding clause wherein the system is configuredto treat the second material to thereby define a first insulative layervia a sintering of the second material.

17. The system of any preceding clause wherein the second material is anelectrically conductive material.

18. The system of any preceding clause wherein the system is configuredto further treat the second material to thereby define a firstinsulative layer via at least one of a chemical treatment and a heattreatment.

19. The system of any preceding clause wherein the second material iselectrically non-conductive.

20. The system of any preceding clause wherein the at least one of achemical treatment and a heat treatment of the second material reducesthe conductivity thereof

What is claimed is:
 1. A method of making a laminated component of anelectric machine, comprising: forming a first lamina of a conductivefirst material; depositing a second material on a first surface of thefirst lamina; treating the second material to thereby define a firstinsulative layer; and forming, on the first insulative layer, a secondlamina of a conductive third material.
 2. The method of claim 1 whereinthe forming of the first and second lamina comprises depositing a metalpowder, on a build surface and the first insulative layer, respectively,and sintering the metal powder.
 3. The method of claim 2 wherein thedepositing and sintering steps are iteratively repeated until the firstand second lamina reach a predetermined respective thickness.
 4. Themethod of claim 1 wherein the second material further comprises a bindermaterial.
 5. The method of claim 1 wherein the treating step comprisessintering the second material.
 6. The method of claim 5, wherein thesecond material is an electrically conductive material.
 7. The method ofclaim 6, wherein the treating step further includes at least one of achemical treatment and a heat treatment.
 8. The method of claim 7,wherein the treating step reduces the conductivity of the secondmaterial.
 9. The method of claim 1, wherein the second materialcomprises at least one of aluminum oxide (Al2O3), silicon carbide (SiC),silicon dioxide (SiO2), magnesium oxide (MgO), zirconium dioxide (ZrO2),yttria stabilized zirconia (YSZ), Silicon Nitride (Si3N4), aluminumnitride (AlN), boron carbide (B4C), and boron nitride (BN), glass,borosilicate glass, quartz, alumino-silicates, silicate ceramics,magnesium silicates, aluminum titanate (Al2TiO5), barium titanate(BaTiO3), or zirconium titanate (ZrTiO4) individually, or incombinations thereof.
 10. The method of claim 7, wherein the chemicaltreatment is a plasma surface treatment.
 11. The method of claim 10,further including the step of heat treating the first insulative layer.12. The method of claim 4, wherein the sintering is a laser sintering.13. The method of claim 1, wherein the conductive first material ismagnetic.
 14. The method of claim 1, wherein the conductive firstmaterial is a different composition from the conductive third material.15. An additive manufacturing system for making a laminated component,configured to: form a first lamina of a conductive first material;deposit a second material on a first surface of the first lamina; treatthe second material to thereby define a first insulative layer; andform, on the first insulative layer, a second lamina of a conductivethird material.
 16. The system of claim 15 wherein the system isconfigured to treat the second material to thereby define the firstinsulative layer via a sintering process.
 17. The system of claim 15,wherein the second material is an electrically conductive material. 18.The system of claim 17, wherein the system is configured to furthertreat the second material to thereby define the first insulative layervia at least one of a chemical treatment and a heat treatment.
 19. Thesystem of claim 15, wherein the second material is electricallynon-conductive.
 20. The system of claim 17, wherein the at least one ofa chemical treatment and a heat treatment of the second material reducesthe conductivity thereof.